Researchers at Cornell University, in Ithaca, N.Y., are doing work that suggests electronic circuits could continue to be miniaturized until they are just a few nanometers thick. The Cornell team reports in this week’s Nature that it has developed a technique for manufacturing the components of electronic circuits on a single one-atom-thick sheet. The result, they say, will be flexible and transparent electronics that are as thin as they can possibly be. Stacking these sheets could someday yield complex, three-dimensional integrated circuits that are still slimmer than any of today’s chips. [read more..]