BINUS UNIVERSITY
BINUS – Huawei ICT Academy
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MIS 01 [R1A] – Soldering & 3D Printing Lab
MIS 02 [HDD] – Heavy-Duty & General Workshop Lab
L1D – Physics Laboratory
L1D – Circuits & Electronics Laboratory
HD05 – Robotics Laboratory
HD04 – Embedded System Laboratory
HD03 – Intelligent Signal Processing Laboratory
HD01 – IEEE Student Branch Room
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Home
Facilities
FACILITIES
MIS 01 [R1A] – Soldering & 3D Printing Lab
MIS 02 [HDD] – Heavy-Duty & General Workshop Lab
L1D – Physics Laboratory
L1D – Circuits & Electronics Laboratory
HD05 – Robotics Laboratory
HD04 – Embedded System Laboratory
HD03 – Intelligent Signal Processing Laboratory
HD01 – IEEE Student Branch Room
![MIS 01 [R1A] – Soldering & 3D Printing Lab](https://comp-eng.binus.ac.id/files/2025/04/20250425_153527-scaled.jpg)
![MIS 02 [HDD] – Heavy-Duty & General Workshop Lab](https://comp-eng.binus.ac.id/files/2025/04/20250425_153925-scaled.jpg)
